FEATURES
High Tg, Halogen free
Middle Loss, Low Z axis CTE
Excellent thermal resistance
Low water absorption, excellent anti-CAF, high reliability
Compatible with lead-free process
APPLICATIONS
Mobile Phone, Computer
Backplane, Card Board
Switch, Server
Heavy Copper Product
Automobile Electronics
GENERAL PROPERTIES
Item | Test Condition | Unit | Spec | Typical value | |
Tg | DSC | ℃ | ≧170 | 180 | |
TMA | ℃ | ≧170 | 184 | ||
DMA | ℃ | ≧200 | 210 | ||
Peel Strength 1oz HTE | 288°C,10s | N/mm | ≧0.7 | 1.15 | |
Peel Strength 1oz RTF | 288°C,10s | N/mm s | ≧0.7 | 0.85 | |
Thermal Stress | 288°C, solder dip | >10 | 180s No delamination | ||
Flexural Strength | Warp | N/mm2 | ≧415 | 550 | |
Fill | ≧345 | 450 | |||
Flammability | E24/125 | - | UL94V-0 | V-0 | |
Surface Resistivity | After moisture | MΩ | ≧1.0x104 | 3.54x108 | |
Volume Resistivity | After moisture | MΩ·cm | ≧1.0x106 | 4.70x1010 | |
Dielectric Constant(RC50%) | 10GHZ C 24/23/50 | - | \ | 4.2 | |
Loss Tangent(RC50%) | 10GHZ C 24/23/50 | - | \ | 0.010 | |
Arc Resistance | D 48/50+D 0.5/23 | S | ≧60 | 130 | |
Dielectric Breakdown | D 48/50+D 0.5/23 | Kv | ≧40 | 60 | |
Moisture Absorption | D 24/23 | % | ≦0.8 | 0.10 | |
Td | Weight Loss 5% | ℃ | ≧320 | 385 | |
CTE in XY/Z Axis | Alpha 1 | TMA | ppm | ≦60 | 33 |
Alpha 2 | ppm | ≦300 | 194 | ||
50-260℃ | % | ≦3.0 | 1.8 | ||
T288(Unclad) | TMA | Min | ≧15 | >60 | |
u Specimen thickness: 1.0mm
u Specification sheet:IPC-4101E/130, is for your reference only.
u Explanation:C:Humidity conditioning
D: Immersion conditioning distilled water.
E: Temperature conditioninge