Glass transition temp.

2.4.25

DSC

℃

185

CTE,Z-axis

2.4.24

α1，TMA

ppm/℃

45

α2，TMA

ppm/℃

270

50~260℃，TMA

%

2.9

Decomposition Temp.

2.4.24.6

TGA

℃

360

T288

2.4.24.1

TMA,copper clad

min

30

Thermal stress

2.4.13.1

Copper clad

sec

>120

unclad

sec

>180

Water absorption

2.6.2.1

E-1/105+D-24/23

%

0.1

Peel Strength/18μm

2.4.8

as received

lb/in

6.5

after thermal stress

lb/in

6.5

Permittivity(RC50%)

2.5.5.9

C-24/23/50,1G

/

4.4

Loss tagent(RC50%)

2.5.5.9

C-24/23/50,1G

/

0.016

Volume resistivity

2.5.17.1

C-96/35/90

MΩ·cm

3.20*10⁸

Surface resistivity

2.5.17.1

C-96/35/90

MΩ

9.80*10⁷

Arc Resistance

2.5.1

D48/50+D0.5/23

sec

122

Dielectric Breakdown

2.5.6

D48/50+D0.5/23

kV

58

Flexural strength

Warp

2.4.4

as received

MPa

565

Fill

2.4.4

as received

MPa

455

Flame resistance

UL-94

A&E-24/125

/

V0

CTI

C-96/20/65

IEC-60112

Rating

PLC3