FEATURES
High Tg: ≥165℃（TMA）, Halogen Free
Low DK/DF(Dk ≤3.4 DF≤0.009 @2GHz)
Excellent Thermal Resistance: Td≥360℃
Low Z-axis CTE
Low water absorption, excellent anti-CAF, high reliability
Compatible with lead-free process
APPLICATIONS
Mobile Phone, Computer
Backplane, Card Board
Switch, Servers
Heavy Copper Product
Automobile Electronics
GENERAL PROPERTIES
Item | Test Condition | Unit | Spec | Typical value | |
Tg | TMA | ℃ | ≧165 | 175 | |
Peel Strength (Hoz) | 288℃,10S | N/mm | ≧0.7 | 1.05 | |
Thermal stress | 288℃,solder dip | S | >10 | 180s No delamination | |
Flexural Strength | Warp | N/mm2 | ≧415 | 550 | |
Fill | ≧345 | 480 | |||
Flammability | E 24/125 | — | UL94V-0 | V-0 | |
Surface Resistivity | After moisture | MΩ | ≧1.0x104 | 3.10x109 | |
Volume Resistivity | After moisture | MΩ· cm | ≧1.0x106 | 4.50x1010 | |
Dielectric Constant（RC70%） | 2GHZC 24/23/50 | — | \ | 3.40 | |
Loss Tangent (RC70%) | 2GHZC 24/23/50 | — | \ | 0.009 | |
Arc Resistance | D 48/50+D 0.5/23 | S | ≧60 | 130 | |
Dielectric Breakdown | D 48/50+D 0.5/23 | kV | ≧40 | 60 | |
Moisture Absorption | D 24/23 | % | ≦0.8 | 0.12 | |
Td | Weight Loss 5% | ℃ | ≧340 | 386 | |
CTE in XY/Z Axis | Alpha 1 | TMA | ppm | ≦60 | 37 |
Alpha 2 | ppm | ≦300 | 223 | ||
50-260℃ | % | ≦3.0 | 2.2 | ||
CTE, X/Y-axis | TMA | ppm | 11-13 | 12 | |
T288(Unclad) | TMA | Min | ≧30 | >60 | |
u Specification sheet: IPC-4101E/130, is for your reference only
u Explanation: C: Humidity conditioning
D: Immersion conditioning distilled water.
E: Temperature conditioning