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HSD7

FEATURES

High Tg, Halogen free

Middle Loss, Low Z axis CTE

Excellent thermal resistance

Low water absorption, excellent anti-CAF, high reliability

Compatible with lead-free 


APPLICATIONS

Servers,Switch

Base Station,Millimeter Wave Radar for Automotive

High Performance Computing


GENERAL PROPERTIES

Item

Test Condition

Unit

Spec

Typical value

Glass Transitiong Temperature(Tg)

DMA

≥200

220

Peel Strength 1oz

RTF As Received

    N/mm

\

0.70

HVLP2 As Received

\

0.65

Thermal stress

288°C, solder dip

s

>10

>180s No delamination

Flexural Strength

LW

N/mm

 

≧345

500

CW

≧345

480

Flammability

E 24/125

-

UL94V-0

V-0

Surface Resistivity

After moisture

MΩ

1.0x105

1x108

Volume Resistivity

After moisture

MΩ· cm

1.0x106

1x109

Dielectric Constant

E Glass RC59%

L1- Glass RC61%

10 GHz Stripline Method

-

\

3.53

3.30

Loss Tangent

E Glass RC59%

L1- Glass RC61%

10 GHZ Cavity Resonator

-

\

0.0035

0.0023

Arc Resistance

D 48/50+D 0.5/23

s

≧60

120

Dielectric Breakdown

D 48/50+D 0.5/23

kV

≧40

62

Moisture Absorption

D 24/23

%

≦0.2

0.08

Td

Weight Loss 5%

≧340

405

CTE in XY/Z Axis

Alpha1

TMA

ppm /

45

45

Alpha2

ppm /

≦260

230

50 - 260°C

%

   ≦2.8

2.3

T288(Unclad)

TMA

Min

≧15

>60

T300 with Cu

TMA

Min

≧2

>60

 

u  Specimen thickness :0.750mm

u  Specification sheet:IPC-4101E/102,is for your reference only

u  Explanation: C: Humidity conditioning D: Immersion conditioning in distilled water

E: Temperature conditioning