FEATURES
Excellent Rigidity and thermal resistance
Low water absorption,Excellent anti-CAF
Halogen,antimony and red phosphorus free
APPLICATIONS
Memory module,Tablet,Notebook
Smart phone,Wearable smart devices
GENERAL PROPERTIES
Item | IPC-TM-650 | Test Condition | Typical value | ||
Glass transition temp. | DSC | ℃ | 165 | ||
2.4.24 | TMA | ℃ | 158 | ||
CTE,Z-axis | 2.4.24 | α1，TMA | ppm/℃ | 27 | |
α2，TMA | ppm/℃ | 235 | |||
50~260℃，TMA | % | 2.6 | |||
Decomposition Temp. | 2.4.24.6 | TGA | ℃ | 386 | |
T288 | 2.4.24.1 | TMA,copper clad | min | 30 | |
Thermal stress | 2.4.13.1 | Copper clad | sec | >120 | |
unclad | sec | >180 | |||
Water absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.11 | |
Peel Strength/18μm | 2.4.8 | as received | lb/in | 7.0 | |
after thermal stress | lb/in | 7.0 | |||
Permittivity(RC70%) | 2.5.5.9 | C-24/23/50,2G | / | 4.0 | |
Loss tagent(RC70%) | 2.5.5.9 | C-24/23/50,2G | / | 0.013 | |
Volume resistivity | 2.5.17.1 | C-96/35/90 | MΩ·cm | 5.70*109 | |
Surface resistivity | 2.5.17.1 | C-96/35/90 | MΩ | 5.54*107 | |
Arc Resistance | 2.5.1 | sec | 130 | ||
Dielectric Breakdown | 2.5.6 | D48/50+D0.5/23 | KV | 60 | |
Flexural strength | Warp | 2.4.4 | as received | MPa | 580 |
Fill | 2.4.4 | as received | MPa | 475 | |
Flame resistance | UL-94 | A&E-24/125 | / | V0 | |
CTI | C-96/20/65 | IEC-60112 | Rating | PLC3 | |
u Specification sheet:IPC-4101/128, for reference only.
u Above typical value is tasted from CCL1.0mm 7628*5,except Dk/Df,the typical value is only for reference，cannot be used as the basis for judgement.